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Showing results: 181 - 195 of 232 items found.

  • Stamped Spring Pin Sockets

    Ironwood Electronics

    Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.

  • Manual Label-Free Molecular Interaction Analysis Machine, Flexible Research Platform

    OpenPleX - HORIBA, Ltd.

    Designed to meet the demands of biologists, biochemists and biophysicists, the OpenPlex is a flexible surface plasmon resonance imaging system.OpenPlex is your companion for the development of label-free and multiplexed bio-assays and molecule detection. It is a robust and compact system designed for simple use and high versatility. Its open format, dedicated sensor chips and manual operation enable numerous types of experiments to be explored without compromise, covering chemistry, biochemistry, physico-chemistry and biomolecular interactions.

  • SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)

    LEC-BW - ADLINK Technology Inc.

    The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.

  • Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)

    Q7-AL - ADLINK Technology Inc.

    The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.

  • Helium Analyzer

    DTX832-He - Bacharach, Inc.

    The Neutronics DTX832-He Helium in Air Analyzer is for helium in air measurement. With an Ethernet digital communication interface along with 4 to 20 mA output, this analyzer combines ease of use with simple installation, configuration, and integration into DCS and PLC control systems. Used with a well-proven thermal sensor technology that combines the sensor element, signal processing and digital calibration on one small chip, this helium analyzer is an ideal choice for demanding and cost sensitive process control applications.

  • Embedded Boards

    UltraZed Family - AVNET

    Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of embedded systems vary from tiny portable devices, to large commercial and industrial installations, and even largely complex systems like medical or military or aviation purposes. Embedded boards can have single MCU chip or multiple MCUs depending on the complexity of application.

  • Vibrator Control System

    FORCE-III - Seismic Source Co.

    The Force 3 Vibrator Control System is the newest generation of vibrator control system. It is designed to control individual vibes, or synchronize entire fleets of trucks. Using GPS, or VHF/UHF radio, for its time base the Force 3 both starts the Vibrator and controls its sweep with unparalleled precision and accuracy.The Force 3 is equipped with the latest ADC chips for better sweep resolution, increased computing power for faster response, GPS for precise source location, 8 Gbytes of internal memory for integrated VSS and PSS data storage, and integrated Wi-Fi for easy data offloading.

  • LARGE CURRENT 1000A PRIMARY CURRENT INJECTION TEST SET

    TEST-901 - Beijing GFUVE Electronics Co.,Ltd.

    TEST-901 primary current injection test set adopts ARM Chip to control its output process and large capacity of toroidal transformers. It is equipped with LCD display and current meter; it can show primary current value, second current value, turn ratio and the action time. Packing is used as aluminum alloy body with PC panel. TEST-901 is mainly applied to CT turn ratio testing in the power system and contact resistance test which need large current.

  • Accelerometers - Special Purpose

    Analog Devices Inc.

    Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.

  • AFDX®/ARINC664P7 Modules

    AIM GmbH

    AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.

  • Accelerometers

    Analog Devices Inc.

    Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.

  • Ultra Low Power Radios

    IoT - Silex Technology

    IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 RadioSingle Stream System (1x1), 20 MHzIntegrated RF front end and PCB trace antennaHostless IoT application development platform with large internal memoryUART AT command set for optional external MCU hostAllJoyn supportWi-Fi Protected Setup SupportIPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host ControllerIdeal for cost effective Internet of Things (IoT) Applications

  • PXI-2536, 544-Crosspoint, 1-Wire PXI Matrix Switch Module

    778572-36 - NI

    544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.

  • ARINC 429 Bus Interfaces

    AIM GmbH

    AIM’s  > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.

  • RTOS

    LynxOS - LynuxWorks, Inc.

    The embedded market is exploding with the dawn of the “Internet of Things”. The basic idea being that almost everything will ultimately be connected to the internet and these embedded devices are becoming more complex. This means they need to run more full functioned operating systems, with connectivity and popular human interfaces, require more processing power, including multi-core chips, and are likely to be exposed to the same types of cyber attacks that we are facing in our corporate and personal computers.Lynx Software Technologies addresses these needs with our high performance LynxOS operating systems and tools based on open standards. Our new powerful RTOS security features allow embedded developers to design their systems to be more secure before they are connected to the internet.

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